3D SIP PCB printed circuit board 5g antenna chip

Here at DUJUD we have invented the world's first additively manufactured 3D System-In-Package (SiP) chip. Our proprietary process exhibits monolithic-like integration of multi silicon dice into a single electronic package without any post-assembly steps. We have developed specialized polymeric materials, custom equipment, and an automated process that enables mass manufacturing of 3D SiP chips for high-profit margin applications.

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