Co-integration of passives and active micro-electronics in a 3D space is achieved for the first time using DUJUD’s proprietary 3D additive micro-fabrication technologies. We offer a set of monolithic-like manufacturing schemes to 3D print and integrate RF components and 3D MEMS devices all on CMOS chips at wafer-scale. This capability creates a large design space that was previously unattainable with conventional 2D fabrication techniques, making our RF electronics first in its class with the emphasis on mass manufacturing from months to weeks.